ASUS H61M-E Intel® H61 LGA 1155 (Socket H2) micro ATX

Intuitive UEFI BIOS and easy network controls on H61 platform

- UEFI BIOS - Flexible & Easy BIOS Interface
- Network iControl - Regulate Network Bandwidth Real-time
- Anti-Surge - Full-time Power Guardian-Make System Free From Risk
- ESD Protection - Protect Your Computer with ESD Guards
- AI Suite II - One-stop Access to Innovative ASUS Features

LGA1155 socket for Intel® 3rd/2nd Generation Core™ i7 / Core™ i5 / Core™ i3 / Pentium® / Celeron® Processors

This motherboard supports the Intel® 3rd/2nd generation Core™ i7/i5/i3/Pentium®/Celeron® processors in the LGA1155 package, with iGPU, memory, and PCI Express controllers integrated to support onboard graphics out with dedicated chipsets, 2-channel (2 DIMMs) DDR3 memory, and 16 PCI Express 3.0/2.0 lanes. This provides great graphics performance. Intel® 3rd/2nd generation Core™ i7/i5/i3/Pentium®/Celeron® processors are among the most powerful and energy efficient CPUs in the world.

Intel® H61 Express Chipset

The Intel® H61 Express Chipset is a single-chipset design to support the new 1155 socket Intel® 3rd/2nd Generation Core™ i7 / Core™ i5 / Core™ i3 / Pentium® / Celeron® processors. It provides improved performance by utilizing serial point-to-point links, which allows increased bandwidth and stability.

PCIe 3.0 Ready

The latest PCI Express bus standard delivers improved encoding for twice the performance of current PCIe 2.0. Total bandwidth for a x16 link reaches a maximum of 32GB/s, double the 16GB/s of PCIe 2.0 (in x16 mode). PCIe 3.0 provides users unprecedented data speeds, combined with the convenience and seamless transition offered by complete backward compatibility with PCIe 1.0 and PCIe 2.0 devices. It’s a must-have feature for PC users aiming to improve and optimize graphics performance, as well as have the latest, most future-proof technology.

Dual-Channel DDR3 2200(O.C )/2133(O.C )/2000(O.C ) /1866(O.C )/1600/1333/1066 support

The motherboard supports DDR3 memory that features data transfer rates of 2200(O.C )/2133(O.C )/2000(O.C )/1866(O.C )/1600/1333/1066 suppor MHz to meet the higher bandwidth requirements of the latest 3D graphics, multimedia, and Internet applications. The dual-channel DDR3 architecture enlarges the bandwidth of your system memory to boost system performance

GreenASUS and ErP Ready

The motherboard is European Union´s Energy-related Products (ErP) ready, and ErP requires products to meet certain energy efficiency requirements in regards to energy consumptions. This is in line with ASUS vision of creating environment-friendly and energy-efficient products through product design and innovation to reduce carbon footprint of the product and thus mitigate environmental impacts.

ASUS H61M-E, Intel, LGA 1155 (Socket H2), Intel® Celeron®, Intel® Pentium®, DDR3-SDRAM, DIMM, Dual-channel